Mid-Level PCB CAD Layout Designer

Viasat is a company focused on delivering global communications connectivity for consumers, businesses, governments, and militaries. The Mid-Level PCB CAD Layout Designer will perform PCB design activities such as placement, routing, design-rule checks, documentation, and design-for-manufacturing checks. The role also involves collaborating with engineering teams, managing CAD data in PLM systems, and supporting engineering change orders.

Responsibilities

• Component placement, routing, DRC, DFM checks, and documentation. Some of the daily tasks will involve
• Utilizing Siemens (formerly Mentor Graphics) Xpedition layout tools, including CES and EDM
• Your design work will follow IPC standards, as well as company and contract manufacturing guidelines
• As a mid-level designer, you will participate in design entry and exit reviews, ensuring adherence to standards and processes
• You will review data from Viasat’s Mechanical Engineering team to ensure the interface between Mech and PCB
• Manage CAD data files and documentation to ensure they are processed are properly into the PLM system
• Collaborate with other team members to ensure high-quality PCBs

Preferred

• Bachelor's degree in an engineering discipline
• Strong communication and problem-solving skills
• Some Multi-layer Flex and Rigid-flex circuits
• Some knowledge of multi-layer PCBs utilizing differential routing, controlled impedance, and RF/analog circuitry
• Some knowledge of Digital designs with fine-pitch BGAs, RF transmission lines, matched lengths, and delay-controlled lengths is a plus
• Some knowledge of RF layouts with partitioning of circuits utilizing shields, specific mounting, and grounding requirements
• Knowledgeable in placing parts by schematic and bypassing capacitors, and in grounding and power schemes
• Engineering Degree
• Multilayer Flex Circuits
• Rigid-Flex Circuits
• Multilayer PCB Design
• Differential Routing
• Controlled Impedance
• RF
• Analog Circuitry
• Digital Design
• Fine-Pitch BGA Design
• RF Transmission Lines
• Length Matching
• Delay-Controlled Routing
• RF Layout
• Circuit Partitioning
• Circuit Shielding
• Component Mounting
• Grounding Requirements
• Schematic-Based Component Placement
• Bypass Capacitor Placement
• Grounding Schemes
• Power Schemes
• Communication
• Problem-Solving

Benefits

• Additional cash or stock incentives may be provided as part of the compensation package.
• A range of medical, financial, and/or other benefits may be provided, dependent on the position offered.

Company

• Satellite internet and connectivity solutions for governments, businesses, and communities
• Carlsbad, California, USA
• http://www.viasat.com/
• Founded in 1986
• 5001-10000 employees

Qualifications

• 2-3+ years of experience in PCB design
• 3+ years of direct experience using Siemens Xpedition, CES, and EDM
• Basic understanding of PCB fabrication processes, tolerances, and IPC standards
• Experience with digital/via stacks, RF/Analog, or mixed PCB Layouts
• Familiar with schematic capture
• Experience working closely with mechanical engineering to define board profiles, technology, and board stack-ups
• Knowledgeable in product documentation, including fabrication & assembly, and PLM systems
• Associate degree in Electronics Engineering Technology or equivalent experience
• Verification of U.S. Citizenship will be required upon accepting employment
• Bachelor's degree in an engineering discipline
• Strong communication and problem-solving skills
• Some Multi-layer Flex and Rigid-flex circuits
• Some knowledge of multi-layer PCBs utilizing differential routing, controlled impedance, and RF/analog circuitry
• Some knowledge of Digital designs with fine-pitch BGAs, RF transmission lines, matched lengths, and delay-controlled lengths is a plus
• Some knowledge of RF layouts with partitioning of circuits utilizing shields, specific mounting, and grounding requirements
• Knowledgeable in placing parts by schematic and bypassing capacitors, and in grounding and power schemes
• 2-3+ years of experience in PCB design.
• 3+ years of direct experience using Siemens Xpedition, CES, and EDM.

Required skills

• PCB Design and Layout, Siemens Xpedition, Xpedition CES, Xpedition EDM, IPC Standards, PCB Fabrication Processes and Tolerances, Schematic Capture, RF/Analog and Mixed-Signal PCB Layout, Flex and Rigid-Flex PCB Design, Differential Routing and Controlled Impedance, PCB Stack-Up and Mechanical Interface Design, PLM Systems

Preferred skills

• Bachelor's degree in an engineering discipline, Strong communication and problem-solving skills, Some Multi-layer Flex and Rigid-flex circuits

Experience

• 2+ years