Application Engineer, Hardware/Firmware (OEM Integrations)
$175K/yr – $245K/yr
You'll complete your application on the employer's website.
$175K/yr – $245K/yr
You'll complete your application on the employer's website.
Job type
Salary
$175K/yr – $245K/yr
Location
Sector
Posted
22 days ago
Responsibilities
Partner with Product and GTM teams pre-contract to assess customer hardware environments and build proof-of-concept integration layers that demonstrate Karman's value
Design and implement the hardware integration layer between Karman and customer infrastructure; review both Utilidata and customer hardware designs to identify integration points and gaps
Write and modify embedded firmware to adapt Karman to each customer's platform
Own end-to-end technical execution for customer hardware integrations, from kick-off through design, validation, release, and deployment
Lead customer-facing technical calls, on-site visits, and requirements reviews with customer engineering, IT, and operations teams
Create and maintain customer integration artifacts, including HW Design Review Checklists, Validation and Test Checklists, Installation and Power-Up Guides, HW Release Timelines, KPI trackers, and After-Action Reports
Develop HW Design Collaterals covering layout, schematic, power, IO, signal integrity, thermal, and RFI requirements
Produce SOM and metrology bring-up documentation, including HW Bring-Up and Power-Up Guides and design reviews for schematics, layouts, and test results
Track hardware KPIs and risks; escalate and coordinate resolution across engineering teams
Take an AI-first approach to automating processes and generating integration and deployment artifacts
Participate in roadmap meetings, sprint planning, and design reviews with the HW team to maintain current product knowledge
Serve as the feedback loop between field deployments and core engineering, translating integration learnings into product improvements
Build out repeatable processes, templates, and best practices to scale the Application Engineering function
Benefits
Stock options
Providing mentorship and growth opportunities as part of a collaborative team
A flexible work environment with flexible paid time off
Health, dental, vision, and employer-match 401(k)
AI power orchestration for data centers and electric grids.
Ann Arbor, Michigan, USA
http://www.utilidata.com
Distribution of Different Job Fields Receiving Sponsorship
40
Represents job field similar to this job
Engineering and Development
Management and Executive
Product Management
Trends of Total Sponsorships
*2023
(2)
2022
(1)
2021
2020
Growth Stage
Total Funding
$155.3M
Key Investors
Renown Capital Partners
Moore Strategic Ventures
Keyframe Capital Partners
2026-05-28
Series C· $40M
2025-04-29
Qualifications
6+ years of hands-on hardware and embedded firmware engineering experience, with a demonstrated ability to independently design, implement, and validate hardware solutions from concept through production
Bachelor's degree in Electrical Engineering, computer science or similar field OR equivalent training and on the job experience
Proven experience designing hardware integration points, including PCB-level design, interface definition, and system bring-up, owned end-to-end
FPGA development experience spanning both hardware design/RTL and firmware
Proficiency writing, modifying, and debugging embedded firmware independently
Working knowledge of embedded and data center interfaces and protocols (e.g., I2C, UART, PCIe, Ethernet)
Ability to read and critically review schematics, PCB layouts, and test results
Demonstrated ability to produce structured engineering artifacts, including design review checklists, test plans, validation procedures, and deployment documentation
Strong communication skills with the ability to present technical content to both engineering and non-engineering audiences
High learning agility in fast-moving, early-stage product environments
Experience in data center infrastructure, power electronics, or energy management hardware
Master's degree in Electrical Engineer or related field
Familiarity with System-on-Module (SOM) platforms or metrology hardware
Knowledge of power quality, thermal management, or power sequencing
Experience with embedded Linux, BSP bring-up, or Yocto-based OS customization
Familiarity with on-device messaging and serialization patterns (e.g., ZeroMQ, Protobuf, gRPC, REST APIs)
Prior experience in a customer-facing technical role such as Field Application Engineer or systems integration engineer
Required skills
Hardware Integration Design, PCB-Level Design, Embedded Firmware, FPGA Development and RTL, I2C, UART, PCIe, Ethernet, Data Center Infrastructure, Power Electronics, Embedded Linux, Yocto
Experience
6+ years
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